Research on the internal temperature sensing mechanism of solid materials based on the correlation of ultrasonic echo envelope area

CUI Yue; GUI Yewei; DU Yanxia; WEI Dong; TIAN Yuan; LI Shaozhuang

doi:10.13700/j.bh.1001-5965.2025.0342

Article Contents

Journal of Beijing University of Aeronautics and Astronautics > 2025 > Accepted Manuscript

CUI Yue, GUI Yewei, DU Yanxia, et al. Research on the internal temperature sensing mechanism of solid materials based on the correlation of ultrasonic echo envelope area[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2025.0342(in Chinese)

Citation:

CUI Yue, GUI Yewei, DU Yanxia, et al. Research on the internal temperature sensing mechanism of solid materials based on the correlation of ultrasonic echo envelope area[J]. Journal of Beijing University of Aeronautics and Astronautics. doi: 10.13700/j.bh.1001-5965.2025.0342(in Chinese)